2016-11-08Wafer Aligner and Wafer Bonder (Technische Universiteit Eindhoven)
The Wafer Aligner and the Wafer Bonder are key equipment to the next generation photonic integrated circuits (PIC). The accurate and reliable matching and bonding of photonic circuits (on InP wafer) with electronic circuits (on silicon wafer) will enable a convergence of photonics and electronics, combining the best of the two worlds.
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