2020-08-06ICP RIE Etcher and PECVD (Technische Universiteit Eindhoven)
The ICP RIE and PECVD systems will be purchased as part of the Interreg North West Europe OIP4NWE program. This program has been set up to bring the production of Photonic Integrated Circuits in InP to a TRL of 7. Therefore the need of a Wafer loading system with direct loading from a standard 3"and 4"cassette system.
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